The NSN 5962-01-266-3037 part numbers 53S841, PC200568-0004, 82S185F, PC73618-1, ROM PROM FAMILY 007 manufactured by Mmi Amd, L 3 Communications Electronicsystems Inc, L 3 Communications Corporation, Philips Semiconductors Inc, Rockwell Collins Aerospace And Ele is available in our inventory. As an ASAP Semiconductor owned and operated website, ASAP Aviation Unlimited has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our NSN 5962-01-266-3037 inventory quickly and efficiently. Our focus on quality control has earned us our FAA AC 0056B accreditation and AS9120B, ISO 9001:2015 certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send an Instant RFQ form from this page for NSN 5962-01-266-3037 parts of Microcircuit Memory, and one of our account managers will respond to it within fifteen minutes or less.
| Alternative NSN: 5962-01-266-3037 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012663037 |
| NCB Code: USA (01) |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 53S841 | mmi amd | microcircuit memory | Avl | RFQ |
| PC200568-0004 | l 3 communications electronicsystems inc | microcircuit memory | Avl | RFQ |
| PC200568-0004 | l 3 communications corporation | microcircuit memory | Avl | RFQ |
| 82S185F | philips semiconductors inc | microcircuit memory | Avl | RFQ |
| PC73618-1 | rockwell collins aerospace and ele | microcircuit memory | Avl | RFQ |
| PC200568-0004 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 007 | dla land and maritime | microcircuit memory | Avl | RFQ |
| HM1-7685-8 | intersil corporation | microcircuit memory | Avl | RFQ |
| PC200568-0004 | rockwell collins aerospace and ele | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.930 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.295 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAU | BODY HEIGHT | 0.200 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 PRINTED CIRCUIT |
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