The NSN 5962-01-274-7927 part numbers X20C04EMB-25, X2004EMB-25, X2004EM-25 C6317, 795099-1, 8507005-255 manufactured by Xicor Inc, Hamilton Sundstrand Corporation, Honeywell International Inc, Dla Land And Maritime, Paeaeesikunta Logistiikkaosasto is available in our inventory. As an ASAP Semiconductor owned and operated website, ASAP Aviation Unlimited has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our NSN 5962-01-274-7927 inventory quickly and efficiently. Our focus on quality control has earned us our FAA AC 0056B accreditation and AS9120B, ISO 9001:2015 certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send an Instant RFQ form from this page for NSN 5962-01-274-7927 parts of Microcircuit Memory, and one of our account managers will respond to it within fifteen minutes or less.
Alternative NSN: 5962-01-274-7927 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 012747927 |
NCB Code: USA (01) |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
X20C04EMB-25 | xicor inc | microcircuit memory | Avl | RFQ |
X2004EMB-25 | xicor inc | microcircuit memory | Avl | RFQ |
X2004EM-25 C6317 | xicor inc | microcircuit memory | Avl | RFQ |
795099-1 | hamilton sundstrand corporation | microcircuit memory | Avl | RFQ |
8507005-255 | honeywell international inc | microcircuit memory | Avl | RFQ |
5962-8771201YA | dla land and maritime | microcircuit memory | Avl | RFQ |
5R8067-042-3002 | hamilton sundstrand corporation | microcircuit memory | Avl | RFQ |
10133817 | paeaeesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | RAM |
ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | 55.0/+125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND BIDIRECTIONAL |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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