The NSN 5962-01-275-0836 part numbers X2864BEMB, X286AEMB-25, X2864BGMB, 10133818, 795073-1 manufactured by Xicor Inc, Paeaeesikunta Logistiikkaosasto, Hamilton Sundstrand Corporation, Advanced Micro Devices Inc is available in our inventory. As an ASAP Semiconductor owned and operated website, ASAP Aviation Unlimited has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our NSN 5962-01-275-0836 inventory quickly and efficiently. Our focus on quality control has earned us our FAA AC 0056B accreditation and AS9120B, ISO 9001:2015 certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send an Instant RFQ form from this page for NSN 5962-01-275-0836 parts of Microcircuit Memory, and one of our account managers will respond to it within fifteen minutes or less.
| Alternative NSN: 5962-01-275-0836 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 012750836 |
| NCB Code: USA (01) |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| X2864BEMB | xicor inc | microcircuit memory | Avl | RFQ |
| X286AEMB-25 | xicor inc | microcircuit memory | Avl | RFQ |
| X2864BGMB | xicor inc | microcircuit memory | Avl | RFQ |
| 10133818 | paeaeesikunta logistiikkaosasto | microcircuit memory | Avl | RFQ |
| 795073-1 | hamilton sundstrand corporation | microcircuit memory | Avl | RFQ |
| AM2864AE 300 BUA | advanced micro devices inc | microcircuit memory | Avl | RFQ |
| X2864AEMB | xicor inc | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.560 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND ERASABLE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CZER | MEMORY DEVICE TYPE | PROM |
| TEST | TEST DATA DOCUMENT | 73030-795073 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| ADAT | BODY WIDTH | 0.458 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
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