The NSN 5962-01-320-4173 part numbers IDT7130LA-70L52B, 5962-8687506BZB, 5962-86875, 5962-8687506ZB, 5962-8687506BZX manufactured by Integrated Device Technology Inc, Dla Land And Maritime is available in our inventory. As an ASAP Semiconductor owned and operated website, ASAP Aviation Unlimited has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our NSN 5962-01-320-4173 inventory quickly and efficiently. Our focus on quality control has earned us our FAA AC 0056B accreditation and AS9120B, ISO 9001:2015 certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send an Instant RFQ form from this page for NSN 5962-01-320-4173 parts of Microcircuit Memory, and one of our account managers will respond to it within fifteen minutes or less.
| Alternative NSN: 5962-01-320-4173 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013204173 |
| NCB Code: USA (01) |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| IDT7130LA-70L52B | integrated device technology inc | microcircuit memory | Avl | RFQ |
| 5962-8687506BZB | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-86875 | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8687506ZB | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8687506BZX | dla land and maritime | microcircuit memory | Avl | RFQ |
| IDT7130LA-70L52S | integrated device technology inc | microcircuit memory | Avl | RFQ |
| 5962-8687506ZA | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8687502ZA | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8687506ZX | dla land and maritime | microcircuit memory | Avl | RFQ |
| 5962-8687506BZA | dla land and maritime | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.739 INCHES MINIMUM AND 0.761 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-6 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 52 LEADLESS |
| ADAU | BODY HEIGHT | 0.082 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 44 INPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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