The NSN 5962-01-341-2449 part numbers XM28C010M, 7108912-001, DPE51288S-300B, MM28C010-300MP manufactured by Xicor Inc, Ge Aviations Systems Llc, Dpac Technologies Corp, Seeq Technology Inc is available in our inventory. As an ASAP Semiconductor owned and operated website, ASAP Aviation Unlimited has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our NSN 5962-01-341-2449 inventory quickly and efficiently. Our focus on quality control has earned us our FAA AC 0056B accreditation and AS9120B, ISO 9001:2015 certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send an Instant RFQ form from this page for NSN 5962-01-341-2449 parts of Microcircuit Memory, and one of our account managers will respond to it within fifteen minutes or less.
| Alternative NSN: 5962-01-341-2449 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013412449 |
| NCB Code: USA (01) |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| XM28C010M | xicor inc | microcircuit memory | Avl | RFQ |
| 7108912-001 | ge aviations systems llc | microcircuit memory | Avl | RFQ |
| DPE51288S-300B | dpac technologies corp | microcircuit memory | Avl | RFQ |
| MM28C010-300MP | seeq technology inc | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.560 INCHES MINIMUM AND 1.640 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.500 INCHES MAXIMUM |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MEMORY MODULE ASSEMBLY |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 5.00 MILLIAMPERES MAXIMUM OUTPUT |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| ADAT | BODY WIDTH | 0.610 INCHES NOMINAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT |
| CSWJ | (NON-CORE DATA) WORD QUANTITY | 128000 |
| CQZP | INPUT CIRCUIT PATTERN | 28 INPUT |
| ADAU | BODY HEIGHT | 0.285 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CRHL | (NON-CORE DATA) BIT QUANTITY | 1024000 |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM ACCESS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
| CZER | MEMORY DEVICE TYPE | EEPROM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND BIDIRECTIONAL |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 500.0 MILLIVOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | ERR-060 MAXIMUM AND ERR-060 MAXIMUM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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