The NSN 5962-01-349-0265 part numbers 258-0163, 258-0163-022, HM465162, HM4-65162B4089 manufactured by Solid State Devices Inc, Rockwell Collins Inc, Micrel Inc, Intersil Corporation is available in our inventory. As an ASAP Semiconductor owned and operated website, ASAP Aviation Unlimited has access to over three billion parts, paired with easy-to-use search engines that enable our customers to browse through our NSN 5962-01-349-0265 inventory quickly and efficiently. Our focus on quality control has earned us our FAA AC 0056B accreditation and AS9120B, ISO 9001:2015 certification, and we are the only independent distributor with a No China Sourcing pledge. If you are ready to get started, you can send an Instant RFQ form from this page for NSN 5962-01-349-0265 parts of Microcircuit Memory, and one of our account managers will respond to it within fifteen minutes or less.
| Alternative NSN: 5962-01-349-0265 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013490265 |
| NCB Code: USA (01) |
| Part No | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 258-0163 | solid state devices inc | microcircuit memory | Avl | RFQ |
| 258-0163-022 | rockwell collins inc | microcircuit memory | Avl | RFQ |
| 258-0163 | micrel inc | microcircuit memory | Avl | RFQ |
| HM465162 | solid state devices inc | microcircuit memory | Avl | RFQ |
| HM4-65162B4089 | intersil corporation | microcircuit memory | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.185 INCHES NOMINAL |
| ABMK | OVERALL WIDTH | 0.508 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
| CZER | MEMORY DEVICE TYPE | RAM |
| ABHP | OVERALL LENGTH | 0.610 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 70.00 MILLIAMPERES MAXIMUM SUPPLY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM ACCESS |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 J-HOOK |
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